Universal cleaning apparatus

ABSTRACT

A cleaning apparatus for cleaning and decontaminating the internal working components of a piece of electronic equipment along a predetermined media path includes a base material having first and second surfaces. The apparatus also includes a cleaning substrate disposed on the first surface for cleaning at least one internal working component of the electronic equipment; and an adhesive substrate disposed on one of the first and second surfaces for decontaminating at least one internal working component of the electronic equipment. The present disclosure also relates to a method for cleaning and decontaminating the internal working components of a piece of electronic equipment along a predetermined media path which includes the steps of: 1) providing a base material having first and second surfaces, the base material having a cleaning substrate disposed on the first surface and an adhesive substrate disposed on the second surface; 2) inserting the base material into the electronic equipment along the predetermined media path; and 3) moving the base material through the predetermined media path such that the cleaning substrate cleans and polishes at least one internal working component of the electronic equipment and the adhesive substrate decontaminates at least one internal working component of the electronic equipment.

CROSS REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefits of and priority to U.S.Provisional Patent Applications Serial No. 60/1133,444 entitled “CLEANLEADER CARD” and No. 60/133,443 entitled “UNIVERSAL CLEANING CARD” bothof which were filed on May 11, 1999 by Audrey Muhr-Sweeney, the entirecontents of each of these applications are hereby incorporated byreference.

BACKGROUND

[0002] The present disclosure relates to a cleaning apparatus designedto clean a wide array of computer peripheral devices, e.g., printers,smart card readers, magnetic readers and the like. More particularly,the present disclosure relates to a universal cleaning card-likeapparatus which has a dual cleaning function: 1) to clean and polish therollers and reading, writing or scan heads (hereinafter “r/w/s heads”)of printers, facsimile machines, copiers, photo and optic sensors,chips, internal optics, smart card readers, smart chips, bar codeencoders and decoders, magnetic readers, scanners and/or the like; and2) to remove lint, dust, paper dust, magnetic oxides, contaminantsand/or other residue from the r/w/s heads, feed or follower rollers/barsdisposed along the paper (or r/w/s head path).

[0003] Heretofore, an alcohol-based solution, e.g., isopropyl alcohol,has been used with some success to clean the heads of theabove-mentioned or similar such devices. However, it is known thatalcohol-based solutions can detrimentally effect the life of the moresensitive, internal working components of these devices, e.g., repeatedcleaning with an alcohol-based solutions can effect the elasticity ofthe feed or follower rollers/bars and/or r/w/s heads. Moreover, It isalso known that bulk shipping alcohol-based solutions can often bedifficult and may require special permits and/or less than efficientshipping methods due certain countries classifying alcohol-basedsolutions as hazardous or unsafe substances.

[0004] Other known cleaning devices employ abrasives on one or bothsides of the cleaning sheet to remove contaminants. However, it is knownthat these abrasives may cause unnecessary wear of the feed or followerrollers and/or the r/w/s heads.

[0005] Thus, there exists a need for a new, simple, yet effective,cleaning apparatus and method according to same for both cleaning theroller and heads of certain electronic equipment and removing excessresidue from the rollers and heads without compromising the integrity ofthe internal working components of the equipment.

SUMMARY

[0006] The present disclosure relates to a cleaning apparatus forcleaning and decontaminating the internal working components of a pieceof electronic equipment along a predetermined media path and includes abase material having first and second surfaces. The cleaning apparatusalso includes a cleaning substrate disposed on the first surface forcleaning at least one internal working component of the electronicequipment and an adhesive substrate disposed on one of the first andsecond surfaces for decontaminating at least one internal workingcomponent of the electronic equipment.

[0007] In one embodiment of the present disclosure, the base material isa lapping film. In a separate embodiment, the cleaning substrate isselected from the group consisting of: aluminum oxide, calcined alumina,cerium oxide, chromium oxide, diamond, ferrous oxide, silicon carbide,silicon dioxide and cubic boron nitrate minerals.

[0008] In yet another separate embodiment of the present disclosure, thecleaning substrate and the adhesive substrate are disposed on the firstsurface. In some cases it may be preferable to include the cleaningsubstrate and the adhesive substrate on the first surface in sections inan alternating manner.

[0009] Advantageously, the base material is semi-compliant and isdimensioned in the shape of a data-carrying card. However, the basematerial can be manufactured in a variety of shapes and sizes forutilization with different electronic devices.

[0010] In one embodiment, the adhesive substrate includes a firstadhesive for adhering to one of the surfaces of the base material and asecond adhesive for decontaminating the internal working components ofthe electronic equipment as the cleaning apparatus moves along thepredetermined media path. In some cases, however, it may be preferableto thermally incorporate the adhesive material onto one of the surfacesof the base material.

[0011] Preferably, the adhesive substrate can be any known adhesive,e.g., chemical adhesive (i.e., latex, acrylic, resin, silicone, neopreneand urethane) pressure sensitive adhesives, contact adhesives, aerosoladhesives, epoxies, solvent-based adhesives, water-based adhesives,curing adhesives, cyanoacrylate adhesives, heat-activated & heatre-activated adhesives and/or cohesive adhesives.

[0012] The present disclosure also relates to a method for cleaning anddecontaminating the internal working components of a piece of electronicequipment along a predetermined media path. The method includes thesteps of:

[0013] 1) providing a base material having first and second surfaces,the base material having a cleaning substrate disposed on the firstsurface and an adhesive substrate disposed on the second surface;

[0014] 2) inserting the base material into the electronic equipmentalong the predetermined media path; and

[0015] 3) moving the base material through the predetermined media pathsuch that the cleaning substrate cleans and polishes at least oneinternal working component of the electronic equipment and the adhesivesubstrate decontaminates at least one internal working component of theelectronic equipment.

[0016] The method may also include the steps of:

[0017] 4) removing the base material from the electronic equipment;

[0018] 5) reorienting the base material such that the other of the firstand second surfaces is oriented to contact at least one additionalinternal working component of the electronic equipment; and

[0019] 6) moving the base material through the predetermined media pathsuch that one of the cleaning substrate and the adhesive substratecontacts the at least one additional internal working component of theelectronic equipment.

[0020] In another method according to the present disclosure, one of thefirst surface and second surfaces of the base material of the providingstep includes both a cleaning substrate and an adhesive substratethereby eliminating the need to implement steps (4) through (6) above.

[0021] In another embodiment, the cleaning apparatus includes a basematerial having first and second surfaces and a cleaning substratedisposed on the first surface for cleaning at least one internal workingcomponent of the electronic equipment. The base material also includes afirst adhesive substrate disposed on the first surface fordecontaminating at least one internal working component of theelectronic equipment and a second adhesive substrate disposed on thesecond surface for adhering the base material to a roll of stock usedwith the electronic equipment.

[0022] Preferably, a plurality of base material is adhered to the stockat varying locations.

BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Other objects and features of the present disclosure will becomeapparent from the following detailed description considered inconnection with the accompanied drawings. It should be understood,however, that the drawings are designed for the purpose of illustrationonly and not as a definition of the limits of the present disclosure.

[0024] An illustrative embodiment of the subject cleaning apparatus andmethod are described herein with reference to the drawings wherein:

[0025]FIG. 1A is a perspective view of a cleaning apparatus or sheetconstructed in accordance with one embodiment of the present disclosurewhich includes a base material having a first surface coated with acleaning substrate and an opposite or second surface coated with anadhesive-like substrate;

[0026]FIG. 1B is a perspective view of another embodiment of thecleaning sheet of FIG. 1 showing the first surface coated with both thecleaning substrate and the adhesive substrate;

[0027]FIG. 2A Is a perspective view with parts separated of anotherembodiment of the cleaning sheet of FIG. 1 showing both the first andsecond surfaces of the cleaning sheet coated with the cleaning substrateand showing a card-like material coated on both sides with adhesives;

[0028]FIG. 2B is a perspective view with parts separated of thecard-like material of FIG. 2A prior to attachment to a prefabricatedroll of printer labels;

[0029]FIG. 3 is a schematic diagram showing the cleaning sheet of FIG. 1as it moves through a predetermined media path (shown in phantom); and

[0030]FIG. 4 is a perspective view of another embodiment of the presentdisclosure showing the adhesive substrate disposed over the leading edgeof the base material.

DETAILED DESCRIPTION

[0031] Referring now in detail to the drawing figures in which likereference numerals identify similar or identical elements, oneembodiment of the present disclosure is illustrated generally in FIG. 1and is designated therein a cleaning apparatus or cleaning sheet 10. Asshown in the accompanying drawings, cleaning sheet 10 is dimensionedgenerally rectilinear in shape to fit through and effectively clean andpolish the internal working components of a piece of electronicequipment as the cleaning sheet moves along the predetermined media pathof the equipment. It is not beyond the scope of the present disclosureto manufacture cleaning sheet 10 in other known shapes to clean otherelectronic equipment. As can be appreciated and by way of example,cleaning sheet 10 can be shaped in the form of a data card to cleanmagnetic or smart card readers, label-shaped to clean various types oflabeling machines and sheet-like to clean printers, facsimile machines,copiers and the like.

[0032] For the purposes herein the term “internal working components” ofelectronic equipment is defined to include, but is not limited to:static and kinetic rollers/bars, r/w/s heads, magnetic heads, internaloptics, and sensors. The term “electronic equipment” as used hereinincludes printers (i.e., polyvinylchloride PVC printers, directprinters, thermal transfer printers and the like), copiers, facsimilemachines, scanners, bar code readers, smart card readers, magneticreaders, optical readers, electronic typewriters or any other piece ofelectronic equipment which includes sensitive internal components whichshould be cleaned on a regular basis. The term “predetermined mediapath” is defined herein as the path in which media, e.g., paper, labels,scanned items, data cards, smart cards, magnetic cards, bar encodeditems, and the like must travel to either print, read, write, scan orotherwise incorporate data. The term “proximal”, as is traditional, willrefer to the end of the apparatus which is closer to the user, while theterm “distal” will refer to the end which is further from the user.

[0033] Cleaning sheet 10 includes a base material 12, e.g., a lappingfilm, preferably made from polyurethane, polyvinylchloride (PVC),acrylic, PET, ABS, thermoplastic, polyester and/or thermoresin or anycombination thereof which includes a first surface 13 and an oppositesurface 15. It is envisioned that base material 12 can also includeacrylic foam, urethane, polyethylene with synthetic paper, cardboardstock, paper, non-woven paper, fiber and/or synthetic suede. Asmentioned above, base material 12 may also vary in thickness dependingupon a particular purpose and/or the particular piece of electronicequipment being cleaned.

[0034] Preferably, at least one surface of the lapping film 12, e.g.,surface 13, is coated with a first material 14 selected from the groupconsisting of aluminum oxide, calcined alumina, cerium oxide, chromiumoxide, diamond, ferrous oxide silicon carbide, silicon dioxide (and/orthe like and/or any combination thereof. It is known that the amount offirst material 14 (hereinafter “cleaning substrate 14”) deposited on thebase material 12, e.g., lapping film, will directly correlate to theoverall cleaning aggressiveness, i.e., effectiveness, of the cleaningsubstrate. The amount of chemical substrate 14 is typically measured inmicron grade. For example, 3M manufactures lapping films having a microngrade range of about 0.1 microns to about 60 microns. Other knownlapping films 12 which are manufactured with the chemical substrate 14disposed on a single side for cleaning and polishing the electronicequipment may also be employed as part of the base material 12 for thepresently disclosed cleaning apparatus.

[0035] As best illustrated in FIG. 1A, the second or opposite surface 15of the lapping film 12 is coated with a second material 16 with adhesiveproperties. Preferably, the adhesive substrate can be any knownadhesive, e.g., chemical adhesive (i.e., latex, acrylic, resin,silicone, neoprene and urethane) pressure sensitive adhesives, contactadhesives, aerosol adhesives, epoxies, solvent-based adhesives,water-based adhesives, curing adhesives, cyanoacrylate adhesives,heat-activated & heat re-activated adhesives and/or cohesive adhesives.

[0036] As explained in more detail below, the cleaning sheet performs adual cleaning function: 1) to clean the r/w/s heads (or rollers) ofprinters (i.e., polyvinylchloride PVC printers, direct printers, thermaltransfer printers or the like), facsimile machines, photo and opticsensors, smart card readers, internal optics magnetic readers and/orother internal working components of electronic equipment; and 2) todecontaminate, i.e., remove contaminants (e.g., lint, dust, paper dust,magnetic oxides and/or other residue), from the r/w/s heads and rollersdisposed along the paper, r/w/s head path.

[0037] As explained in more detail below with respect to FIG. 3, thisenables a user to clean the feed 50 a and 50 b and/or follower rollers60 a and 60 b and r/w/s head(s) 75 (see FIG. 3) with the cleaningsubstrate 14 and simultaneously, sequentially and/or subsequently removelint and/or other contaminants from the rollers 50 a, 50 b, 60 a, 60 band r/w/s heads 75 with the adhesive substrate 16 with the same cleaningsheet 10 simply by feeding the cleaning sheet into the media path (i.e.,reading, writing, scanning and/or printing path) of the electronicequipment.

[0038]FIG. 1B shows another embodiment of the present disclosure whereinone surface of the cleaning sheet 100 is coated with the cleaningsubstrate 114 selected from the above group and the same surface is alsoat least partially coated with the adhesive substrate 116. As can beappreciated, this enables the user to clean and remove contaminants fromall of the rollers 50 a, 50 b, 60 a, 60 b and r/w/s heads with one passof the cleaning sheet 110. Alternatively, both sides of the lapping film112 can be coated with both the cleaning substrate 114 and the adhesivesubstrate 116.

[0039] As can be appreciated by the present disclosure, an alcohol-basedcleaning solution is not used to clean the r/w/s heads 75 and/or therollers 50 a, 50 b, 60 a, 60 b since it is commonly known that repeatedcleaning with alcohol-based solutions, e.g., isopropyl alcohol and thelike, may cause detrimental effects on the rollers and/or r/w/s heads,e.g., repeated cleaning with an alcohol-based solutions may effect theoverall elasticity of the rollers.

[0040]FIG. 2A shows another embodiment of the cleaning sheet 200 whereina card-like adhesive material/substrate 216 having adhesive qualities onboth sides is applied to the lapping film 212 to remove contaminants ina similar manner as described above. It is envisioned that the adhesive216 used to affix the adhesive material 220 to the lapping film 212 maybe the same or different than the adhesive 216 used to clean the rollers50 a, 50 b, 60 a, 60 b and/or r/w/s heads 75. The adhesive material 220may be affixed to the lapping film 212 manually prior to inserting thecleaning sheet 200 within the electronic equipment or may be affixed tothe lapping film 212 during the manufacturing process.

[0041] For example, FIG. 2B shows one preferred location of an adhesivestrip 300 adhered to a roll 330 of labels 340. Preferably, adhesivestrip 300 includes one adhesive 318 used to affix the strip 300 to thelabel roll 330 and a second adhesive 316 designed to remove lint orother debris from the r/w/s heads and/or rollers disposed along thelabel printing path. Alternatively, the adhesive strip 300 may beaffixed to the label roll 330 (or, as the case may be, label fanfold) inany known manner, e.g., thermal bonding and the like. Preferably,adhesive 318 is selected from a group of adhesives having high adhesivecharacteristics, i.e., high tack level or strength level, to assureaffixation to the label roll 330.

[0042] It is envisioned that by manufacturing the roll 330 of labels 340in this fashion, i.e., with the adhesive strip 300 included at the endof the roll 330 of labels 340 eliminates manual cleaning of the labelingdevice, i.e., eliminates the need for users to clean/decontaminate thelabel path after a certain number of uses. As can be appreciated by thepresent disclosure, the adhesive strip 300 can be applied to the labelroll 330 in lieu of the last label 340 or, alternatively, severaladhesive strips 300 can be incorporated with the label roll 330 todecontaminate/clean the labeling device on a more frequent basis.Alternatively, the adhesive strip 300 can be sold separately andmanually applied to any roll of labeling stock in the same manner asdescribed above with respect to FIG. 2A.

[0043] Turning now to FIG. 3 which shows a schematic diagram of thecleaning sheet 100 as it is inserted through a pair of feeding rollers50 a and 50 b along a predetermined media path designated by arrows “A”,“A′” and “A″”. More particularly, cleaning sheet 100 which, as mentionedabove and by way of example, includes the cleaning substrate 114 andadhesive 116 disposed on the same side of lapping film 112, is initiallyinserted through rollers 50 a and 50 b which conjointly rotate inwardlyto draw the cleaning sheet 100 through the path (i.e., from arrow A toarrow A′). As cleaning sheet 100 is drawn through rollers 50 a and 50 b,the adhesive substrate 116 removes any contaminants on roller 50 a andsubsequently (or sequentially) the cleaning substrate 114 cleans roller50 a.

[0044] As the cleaning sheet 100 is drawn along the cleaning path from Ato A′ and from A′ to A″, the r/w/s head 70 which may include orincorporate other components, e.g., magnetic heads, optics, and/or thelike, is subsequently decontaminated and cleaned in the same manner asroller 50 a. Likewise, roller 60 a is decontaminated and cleaned as thecleaning sheet 100 is drawn between rollers 60 a and 60 b.

[0045] Again, it is envisioned that the cleaning substrate 114 andadhesive substrate 116 may be disposed on both sides of the lapping film112 which, obviously, eliminates the need to repeat the cleaning processto clean bottom rollers 50 b and 60 b. Moreover, in some cases it may bepreferable to insert the cleaning sheet 100 such that the cleaningsubstrate 114 initially cleans the roller 50 a prior to the adhesivesubstrate 116 removing any contaminants which may result duringcleaning. Still, in other cases it may be preferable to include aplurality of cleaning substrate strips 114 with alternating adhesivestrips 116 disposed along the same or opposite sides of the lapping film112 depending upon a particular purpose or to promote better or moreeffective cleaning and polishing of the rollers 50 a, 60 a and/or r/w/shead(s) 75.

[0046] It is envisioned that any of the aforedescribed cleaning sheets,i.e., 10, 100, 200, 300 and/or 400 (or any combination thereof) may beused in the same or similar manner to clean various types of electronicequipment.

[0047] The present disclosure also relates to a method for cleaning anddecontaminating the internal working components of a piece of electronicequipment along a predetermined media path. The method includes thesteps of:

[0048] 1) providing a base material 12 having first and second surfaces,13 and 15, respectively, the base material having a cleaning substrate14 disposed on the first surface 13 and an adhesive substrate 16disposed on the second surface 15;

[0049] 2) inserting the base material 12 into the electronic equipmentalong the predetermined media path (e.g., from A to A′ to A″ in FIG. 3);and

[0050] 3) moving the base material 12 through the predetermined mediapath such that the cleaning substrate 14 cleans and polishes at leastone internal working component of the electronic equipment and theadhesive substrate 16 decontaminates at least one internal workingcomponent of the electronic equipment.

[0051] Preferably, at least one of the first and second surfaces 13, 15,respectively, of the base material of the providing step includes both acleaning substrate 14 and an adhesive substrate 16.

[0052] The method can also include additional steps, e.g.:

[0053] 4) removing the base material 12 from the electronic equipment;

[0054] 5) reorienting the base material 12 such that the other of thefirst and second surfaces 13, 15, respectively, is oriented to contactat least one additional internal working component of the electronicequipment; and

[0055] 6) moving the base material through the predetermined media pathsuch that one of the cleaning substrate 14 and the adhesive substrate 16contacts the at least one additional internal working component of theelectronic equipment.

[0056] From the foregoing and with reference to the various figuredrawings, those skilled in the art will appreciate that certainmodifications can also be made to the present disclosure withoutdeparting from the scope of the same. For example, the adhesivesubstrate described herein with respect to cleaning sheets 10, 100, 200and 300 may include any commercially known adhesive, epoxy or glue withvarying adhesive strengths. Moreover, the adhesive and/or cleaningsubstrates may be applied in a specific pattern depending upon aparticular purpose or to achieve a particular result, e.g., alternatingpattern, tab-like pattern or stripe-like pattern. Moreover and as bestillustrated in the cleaning apparatus 400 of FIG. 4, the adhesivesubstrate 416 and/or the cleaning substrate 141 may be applied to anedge 425 of the base material 412 to accomplish the purposes of thepresent disclosure, i.e., clean and decontaminate the internal workingcomponents of a piece of electronic equipment. It is envisioned thatedge 425 may include the leading, trailing or side edges of the basematerial 412 and/or any combination thereof.

[0057] Still, further, although the present disclosure teaches away fromthe use of alcohol-based cleaning solutions and alcohol-based adhesivesdue to the various complications known in the industry and describedabove, it is not beyond the scope of the present disclosure to apply analcohol-based adhesive during the manufacturing process which evaporatesor otherwise dries and forms an adhesive substrate on the lapping film.

[0058] Moreover, it is not beyond the scope of the presently disclosedcleaning apparatus to utilize the cleaning apparatus with certainelectronic equipment which may require repeatedly moving the cleaningapparatus through the r/w/s heads or rollers to accomplish both cleaningand decontaminating the internal working components of the electronicdevice. For example, certain magnetic or card readers are classified asswipe readers or dip and insert readers which may require reinsertion ofthe cleaning apparatus in a different orientation to promote moreeffective cleaning and/or decontamination of the internal workingcomponents.

[0059] While several embodiments of the disclosure have been describedherein, it is not intended that the disclosure be limited thereto, as itis intended that the disclosure be as broad in scope as the art willallow and that the specification be read likewise. Therefore, the abovedescription should not be construed as limiting, but merely asexemplifications of preferred embodiments. Those skilled in the art willenvision other modifications within the scope and spirit of the claimsappended hereto.

What is claimed is:
 1. A cleaning apparatus for cleaning anddecontaminating the internal working components of a piece of electronicequipment along a predetermined media path, comprising: a base materialhaving first and second surfaces; a cleaning substrate disposed on saidfirst surface for cleaning at least one internal working component ofthe electronic equipment; and an adhesive substrate disposed on one ofsaid first and second surfaces for decontaminating at least one internalworking component of the electronic equipment.
 2. A cleaning apparatusaccording to claim 1 wherein said cleaning substrate is selected fromthe group consisting of: aluminum oxide, calcined alumina, cerium oxide,chromium oxide, diamond, ferrous oxide, silicon carbide, silicon dioxideand cubic boron nitrate minerals.
 3. A cleaning apparatus according toclaim 1 wherein said base material includes a lapping film.
 4. Acleaning apparatus according to claim 1 wherein said cleaning substrateand said adhesive substrate are disposed on at least the same surface.5. A cleaning apparatus according to claim 4 wherein said cleaningsubstrate and said adhesive substrate are disposed on said first surfacein strips in an alternating manner.
 6. A cleaning apparatus according toclaim 1 wherein said base material is semi-compliant.
 7. A cleaningapparatus according to claim 1 wherein said base material is dimensionedin the shape of a data-carrying card.
 8. A cleaning apparatus accordingto claim 1 wherein said adhesive substrate includes a first adhesive foradhering to said at least one surface of said base material and a secondadhesive for decontaminating said internal working components as saidcleaning apparatus moves along the predetermined media path.
 9. Acleaning apparatus according to claim 1 wherein a first side of saidadhesive substrate is thermally incorporated onto said at least onesurface of said base material and a second side of said adhesivesubstrate includes an adhesive for decontaminating said internal workingcomponents as said cleaning apparatus moves along the predeterminedmedia path.
 10. A cleaning apparatus according to claim 1 wherein saidadhesive substrate is selected from the group consisting of: pressuresensitive adhesives, contact adhesives, aerosol adhesives, epoxies,solvent-based adhesives, water-based adhesives, curing adhesives,cyanoacrylate adhesives, heat-activated & heat re-activated adhesivesand cohesive adhesives.
 11. A cleaning apparatus according to claim 1wherein one of said adhesive substrate and said cleaning substrate isdisposed over an edge of said base material.
 12. A method for cleaningand decontaminating the internal working components of a piece ofelectronic equipment along a predetermined media path comprising thesteps of: 1) providing a base material having first and second surfaces,said base material having a cleaning substrate disposed on said firstsurface and an adhesive substrate disposed on said second surface; 2)inserting said base material into the electronic equipment along thepredetermined media path; and 3) moving said base material through saidpredetermined media path such that said cleaning substrate cleans andpolishes at least one internal working component of the electronicequipment and said adhesive substrate decontaminates at least oneinternal working component of the electronic equipment.
 13. A methodaccording to claim 12 wherein at least one of said first surface andsecond surfaces of said base material of said providing step includesboth a cleaning substrate and an adhesive substrate.
 14. A methodaccording to claim 12 wherein said adhesive substrate of said providingstep includes a first adhesive for adhering said adhesive substrate tosaid base material and a second adhesive for decontaminating theinternal working components of the electronic equipment.
 15. A methodaccording to claim 12 wherein said base material of said providing stepis selected from the group consisting of: aluminum oxide, calcinedalumina, cerium oxide, chromium oxide, diamond, ferrous oxide, siliconcarbide, silicon dioxide cubic boron nitrate minerals.
 16. A methodaccording to claim 12 further comprising the steps of: 4) removing saidbase material from the electronic equipment; 5) reorienting said basematerial such that the other of said first and second surfaces isoriented to contact at least one additional internal working componentof the electronic equipment; and 6) moving said base material throughsaid predetermined media path such that one of said cleaning substrateand said adhesive substrate contacts said at least one additionalinternal working component of the electronic equipment.
 17. A cleaningapparatus for cleaning and decontaminating the internal workingcomponents of a piece of electronic equipment along a predeterminedmedia path, comprising: a base material having first and secondsurfaces; a cleaning substrate disposed on said first surface forcleaning at least one internal working component of the electronicequipment; and a first adhesive substrate disposed on said first surfacefor decontaminating at least one internal working component of theelectronic equipment; and a second adhesive substrate disposed on saidsecond surface for adhering said base material to a roll of stock usedwith the electronic equipment.
 18. A cleaning apparatus according toclaim 17 wherein a plurality of said base material is adhered to saidstock at varying locations.